الأرشيف لـ 'عنصرية'تصنيف

Digital Right Management : The Worst Apples Are Very Rotten And Very Greedy

2006 / مايو / الثلاثاء

Introduction: 

Digital Rights Management , what a term !

Digital Rights Management is the term being used for companies to take control of your computer and drive it in the roads they want you to go !

Event : 

French Parilament is Currently Discussing the DRM scheme : 

If France bans device-specific digital music and video downloads, companies like Apple would presumably need to alter technology to allow content from Web sites to play on competitive devices. This movement toward interoperability could eventually become global, and could loosen Apple's stranglehold on the digital music player market.

Apple iPod, iTunes, and Greed on big scale 

Story :

In an interview last week with the International Herald Tribune, Renaud Donnedieu de Vabres, the French minister of culture, said: "I have absolutely nothing against iTunes, and this is not some payback or protectionism against a foreign company."

He continued, "We are simply defining a fundamental value and principle that I believe will be demanded by Internet users and consumers."

InterOperability : Music Playing Programs Shuold Be Able To Play The Songs

Industry sources speculated that the proposed regulation, if enacted, might force Apple to cease digital music sales in France, or STOP its "digital rights management" scheme of encoding music in such a way that only Apple iPods can play the songs and music it puts in its iTunes website.

If the two houses of the French Parliament stand with the rights of the people of France, then the U.S. Commerce Department will back Apple Computer Inc. in the dispute that will be a good story to follow.

Comment:

Apple Computer Inc. is rotten and very rotten indeeed. It is technology was one day good, not any more, and the reason is simple : GREED

Related resources:

http://en.wikipedia.org/wiki/Digital_rights_management

http://www.eff.org/about/

Professor Asad Abidi Develops A Universal Chip for Cell Phones

2006 / مايو / الأثنين

A Universal Chip for Cell Phones

News : A universal radio antenna receives all kinds of signals traveling through the air  some strong, some weak  and all at different frequencies.

In order to convert every analog signal to digital signals, a chip would require an analog to digital converter that burns “several hundred watts” of power, says Prof. Abidi far too much for a portable device.

Therefore, his team used a modified version of SDR that exploits the fact that not all incoming signals need to be converted at once. People are usually interested in only one channel at a time, he says, such as using Wi Fi or talking via a specific frequency on a cellular network.

So Abidi research group incorporated a type of device – previously used only in obscure applications into their circuit that’s able to examine the vast range of radio frequencies, pick out the band of interest, and emphasize it, while de emphasizing the others. In essence, this device – what engineers call a “wideband anti aliasing device” – is able to access the spectrum and focus on a single band, so that only small amounts of analog information need to be converted to a digital signal. By building band choosing into the circuit, the analog to digital conversion takes only tens of milliwatts of power, Professor Abidi says.

Their advance, he notes, starts from discovering the potential for this previously under used wideband anti aliasing device and integrating it with other wide band circuit components to build a complete receiver. “The concept had been around for a while,” he explains, “but no one saw how powerful it would be for software defined radio applications.”

“A chip that sorts out the incoming signal such as Prof. Abidi’s is the type of technology that could help SDR become a reality in cell phones”, says Bruce Fette, chief scientist of communication networks at General Dynamics C4 Systems, a company that builds large software defined radio equipment for military use. And the idea of SDR is becoming more attractive to the mobile device industry, he says, because it provides so much more flexibility in the functions of a single device, ranging from using the same cell phone all over the world, to having a PDA unlock your car door.

Prof. Abidi says there’s still more research to be done before the chip is ready for commercial applications. For one thing, his team has only solved the problem of converting incoming analog to digital signals over such a wide range of frequencies.

Wireless devices must also transmit an outgoing analog signal. A truly universal chip will need to convert outgoing signals from digital to analog form over a similarly wide range of frequencies. Still, his team has solved the most difficult part of the problem by addressing the receiver, Prof. Abidi says. Incoming signals are much more complicated because, with a receiver, “you’re listening to the whole world,” he says, whereas “with transmitters, you’re not contending with unwanted signals.”

Prof. Abidi and his team hope to smooth out the remaining technical issues with their universal chip by late summer. From there, the work of other researchers who design the digital processor and software for SDR will come into play, he says. Professor Abidi estimates that all these pieces will come together for a prototype sometime next year. And, he says, a universal chip could be in handheld wireless gadgets within three to five years.

Source : http://www.technologyreview.com/read_article.aspx?id=16756&ch=infotech
Information: (AA) research group comes with a single chip advanced mobile phone
Note : (AA) UCLA research group = Asad Abidi research group at UCLA More
Information: http://www.icsl.ucla.edu/aagroup/
 
Professor Asad Abidi

Asad A. Abidi received the B.Sc. (with Honors) degree from Imperial College, London, U.K. in 1976, and the M.S. and Ph.D. degrees in electrical engineering from the University of California, Berkeley, in 1978 and 1981, respectively.

He was at Bell Laboratories, Murray Hill, NJ, from 1981 to 1984 as a Member of Technical Staff in the Advanced LSI Development Laboratory. Since 1985, he has been with the Electrical Engineering Department of the University of California, Los Angeles, where he is Professor.

He was a Visiting Faculty Researcher at Hewlett Packard Laboratories in 1989. His research interests are in CMOS RF design, data high speed analog integrated circuit design, conversion, and other techniques of analog signal processing.

Dr. Abidi was the Program Secretary for the International Solid State Circuits Conference from 1984 to 1990, and General Chairman of the Symposium on VLSI Circuits in 1992. He was Secretary of the IEEE Solid state Circuits Council from 1990 to 1991. From 1992 to 1995, he was Editor of the IEEE Journal of Solid State Circuits.

Dr. Abidi received an IEEE Millennium Medal. He has received the 1988 TRW Award for Innovative Teaching and the 1997 IEEE Donald G. Fink Award. He was a corecipient of the Best Paper Award at the 1995 European Solid state Circuits Conference, the Jack Kilby Best Student Paper Award at the 1996 International Solid state Circuits Conference (ISSCC), the Jack Raper Award for Outstanding Technology Directions Paper at the 1997 ISSCC, and the Design Contest Award at the 1998 Design Automation Conference, and received an Honorable Mention at the 2000 Design Automation Conference. 

Office: 53 143, Eng. IV, UCLA

Homepage: http://www.icsl.ucla.edu/aagroup/aaa

Biography: http://www.icsl.ucla.edu/aagroup/cv.html

Students:
Abbas Amirichimeh (Ph.D. Student)
Abbas Amirichimeh received his B.Sc. (with Honors) in Electrical Engineering with emphasis on Microelectronics from Iran University of Science and Technology, Tehran, Iran, and ranked 4th in the class of 1988. During his bachelors program, he worked on several projects including a “Low Frequency Digitized Sweep Generator”. Abbas was with the Air Force for 5 years working on a G&C system before he joined Center for Advanced Electron Devices and Systems (CAEDS), University of Texas at Arlington in 1994 where he worked as a research assistant on 0.5 micron GaAs MESFETs and passive components at the device level and designed several monolithic wideband amplifiers. He received his Masters degree in GaAs MMIC circuits and technology with G.P.A 4.00 in 1995. Abbas was with Intel High Performance Architecture Group (IAG) in Portland, Oregon, from 1996 to 2000 working as an integral member of High-Speed Circuit Group (Fireball) in Pentium 4 development team (Willamette) where he developed and designed the Scheduler Scoreboard Unit (SSU) Fireball critical circuitries running at 2X the frequency of the rest of the chip, custom circuits and layouts running at 3GHz+ on Intel’s 0.18 micron process. Abbas joined Broadcom Networking Business Unit, Irvine, California, in 2000 and has been designing 10Gb/S SERDES chips since then. He joined UCLA Integrated Circuits and Systems Lab (ICSL) in fall 2002 where he is working toward his Ph.D. degree in the field of Analog Circuit Design. His research interests are RF, Analog and Mixed-Mode Circuits.
Abbas has been a member of IEEE since 1987 and has published a paper in “2000 Intel Design and Technology Conference (IDTC)” on “High frequency on-die interconnect modeling”, and a paper in  “1996 International Conference on GaAs Manufacturing Technology,” on “Electrostatic discharge protection for GaAs devices and MMIC circuits”.
 
 

Rahim Bagheri (Ph.D. Student)


Rahim Bagheri received the B.Sc. (Ranked First) in EE and M.S. in BioElectric both from Sharif University of Technology,Tehran,Iran in 1997 and 1999 respectively. He joined UCLA in 1999, studying toward his Ph.D. and was a Graduate Student Researcher in MOSFET Research Lab (UCLA,1999-2000) working on deep submicron CMOS devices. He was at Valence Semiconductor, Irvine, as a senior design member of wireless group(2000-2001). His current research is the design of High Efficiency Linear RF Transmitters in ICSL, UCLA.
Rahim is the recipient of Gold Medal in national physics olympiad (IRAN) and Honorable Mention Diploma in the XXIV International Physics Olympiad,Virginia, USA. 
Homepage: www.icsl.ucla.edu/~rahim
 
 

Rodney Chandler (M.S. Student)
Rodney Chandler received the B.E. (Electrical and Electronic) from the University of Queensland, Australia in 1998. From 2001-2003, Rodney worked for Cisco Systems Wireless Networking Business Unit (formerly Radiata) in Sydney, Australia, designing Analog to Digital Converters (ADC) and analog baseband filters. This work resulted in two patents related to design of ADCs. He joined the Integrated Circuits and Systems Lab (ICSL) at UCLA in Fall 2003, and is currently studying for the M.Sc. degree. His research interests are high speed Analog-to-Digital converters, wireless transceivers for high speed networks, and analog filters. Rodney plans to continue to the Ph.D. degree, after completing the M.Sc.

Jae-Hong Chang (Visiting Scholar)
Jae-Hong Chang was born in Republic of Korea. He received the B.Sc. degree in Electronic engineering at Kyungpook national university, Daegue, Korea, in 1998 and the M.S. degree in EECS at Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea in 2000, respectively. He is currently working toward the Ph.D. degree in EECS at KAIST. He was at RF CMOS TEAM in ETRI, Daejeon, as a part time engineer (2000-2002). His current research interests include the RF CMOS IC design, passive and active device modeling and RF MEMS. He received the Silver Prize in 9th 2003 Samsung Humantec Thesis Award.

Saeed Chehrazi (Ph.D. Student)


Saeed Cheharzi received his B.Sc. from Sharif University of Technology, Tehran, Iran in 2001 and his M.S. from University of California, Los Angeles in 2004. His research interests are RF, Analog and Mixed Mode Circuit Design.
Saeed was the Software Committee chair of the International Millennium Seminar on Electrical Engineering (IMSEE) held at Sharif Univ. of Tech. on March 1-3, 2000. He received the UCLA Graduate Division Fellowship for Fall 2001.

Mohammad Esmaeil Heidari (Ph.D. Student)


Mohammad Esmaeil Heidari received his B.Sc. degree in electrical engineering in 1995 and MS degree in electrical engineering in 1997 both from Sharif University of Technology, Tehran, Iran. From 1997 to 2000, he was with Emad Semiconductor Co., designing CMOS analog IC for high precision data converters, analog filters and power amplifiers. He joined Valence Co. in 2000 and was involved in the design of analog sections of Codec for telephony applications.  He is currently a Ph.D. candidate at Integrated Circuits and Systems Lab (ICSL), University of California, Los Angeles. His research interests are in the area of low power CMOS RF transceivers, low phase noise Phase Locked Loops and Delta-Sigma data converters. 

Aly Ismail (Ph.D. Student)


Aly Ismail received his B.Sc. and M.S.degrees both in electrical engineering from Cairo University, Giza, Egypt, in 1998 and 2000 respectively. Since September 2000, he has been with the University of California, Los Angeles as a Graduate Student Researcher. In January 2002, he joined Conexant Systems where he was working on the design of BICMOS RF circuits for cellular systems.
He is currently working toward his Ph.D. degree in integrated circuits and systems, his research is involved in the design of Ultra Wide-Band (UWB) receivers in CMOS technology. 

Minjae Lee (Ph.D. Student)


Minjae Lee received his B.Sc. and M.S. degrees both in electrical engineering from Seoul National University, Seoul, Korea in 1998 and 2000 respectively.
He was a consultant with GCT semiconductor, Inc., and Silicon Image Inc., designing analog circuits for wireless communication and digital signal processing blocks for Gigabit Ethernet. He joined Silicon Image Inc., in 2001, developing Serial ATA product. Since 2003,  he has been working toward the Ph.D. degree in the field of analog and mixed mode circuit design at ICSL, UCLA.

Ahmad Mirzaei (Ph.D. Student)


Ahmad Mirzaei was born in Tabriz, Iran, in 1978. He received the B.Sc. and M.S. degrees (with honors) both in Electrical Engineering from Sharif University of Technology, Tehran, Iran in 2000 and 2002 respectively. He was working in Novin Rayaneh and Emad Company in designing of high speed data-converters and  RF frequency synthesizers. He is currently studying toward his PhD. in Electrical Engineering at University of California at Los Angeles. His main research interests include high speed analog integrated circuit design, high speed low-voltage ADCs, RF integrated circuit design and High-Frequency Gm-C Filters. He was the winner of Silver Medal in National Mathematical Olympiad in 1996, and was the first rank in Student Olympiad in Electronics in Iran in 2002. He was also the first rank in National University Entrance exam in Iran in 2000.

Sohrab Samadian (Ph.D. Student)


Sohrab Samadian received his B.Sc. in electrical engineeing from Sharif University of Technology, Tehran, Iran in 1998 and his M.Sc. from UCLA in 2002 where he’s pursuing his PhD degree. His research interests are RF and analog circuit design and low power frequency demodulators. He worked on a direct conversion receiver for Bluetooth and especially on a low power demodulator for his Masters. Sohrab is currently with Sequoia Communications, San Diego working on 3G transceivers. Sohrab is the recepient of the design contest award at International Symposium on Low Power Electronics and Design, 2002 and the design contest award of the 16th International conference on VLSI Design, India, 2003 for his work on low power GFSK demodulator. He also received APSIH’s award of excellence in engineering education in April 2003.
Zheming Li (Ph.D. Student)
Shervin Moloudi (Ph.D. Student)

Alumni: Hooman Darabi (Ph.D., 1999)
Hooman Darabi was born in Tehran, Iran in 1972. He received the B.Sc. and M.S. degrees in Electrical Engineering from Sharif University of Technology, Tehran, Iran in 1994 and 1996 respectively. He received the Ph.D. degree from the University of California, Los Angeles in 1999. He is currently a principle scientist in Broadcom Corporation, El Segundo, CA. His interests include analog and RF IC design for wireless communications. 

Emad Hegazi (Ph.D., 2002)


Emad Hegazi received his M.S. from Ain Shams University, Cairo, Egypt, in 1998 and his Ph.D. from University of California, Los Angeles in 2002. He joined UCLA Integrated Circuits and Systems Lab. in 1998. His Ph.D. research was focused on Fractional-N Frequency Synthesizer Design. His research interests are Low Phase noise VCO design,  Nonlinear Circuits, Frequency Synthesizer design and optimization methods. He is currently an Assistant Professor at Ain Shams University, Egypt.
Emad is the recipient of the IEEE Solid-State Circuits Society Pre-doctoral Fellowship award (2001-2002) and ADI Outstanding Student Designer Award from Analog Devices Inc., 2000. He has received the UCLA Graduate Division Fellowship for 1999 and the Outstanding Doctor of Philosophy in Electrical Engineering Award from UCLA.
Homepage: http://www.icsl.ucla.edu/~emad

Ali Karimi (Engineer Degree, 2001)


Ali Karimi was born in Tehran, Iran in March 1974. He received the B.Sc. and M.S. degrees (highest honors) in electrical engineering from Sharif University of Technology, Tehran, Iran, in 1995 and 1997, respectively. He received the Engineer Degree from the University of California, Los Angeles in March 2001 focusing on researches about 2.4GHz WLAN and 2.1GHz WCDMA receivers. His area of interests include analog IC’s for communication either wireless or optical applications.
Homepage: http://www.icsl.ucla.edu/~karimi

Daniel Q. Sun (Ph.D., 2004)

Daniel Qicheng Sun received B.E. in 1989 from Tsinghua University, Beijing, China, and M.Eng. in 1996 from National University of Singapore, Singapore. He is now pursuing the Ph.D. degree in eletrical engineering at University of California, Los Angeles. In 1989-1993, he was with the National Lab on Digital Microwave Communications at Tsinghua University, Beijing, China. In 1996, he joined Data Storage Insitute, Singapore, where he was engaged in the circuits design of the first MDFE read channel. Since 1997, he has been a Graduate Student Researcher at UCLA. His research interests include high-speed mixed-signal IC design, HDD read channels, signal processing and communications. 

Andrea Xotta (Visiting Scholar, 2002)
Andrea Xotta received his “Laurea” degree (summa cum laude) in electrical engineering from University of Padova, Padova, Italy in 1999, where he is currently a Ph.D. Student. His Ph.D. research activity is focused on development of analog turbo decoder for Hard Disk (HD) applications. His research interests include continuous-time filters, sampled-data analog filters and analog turbo decoders. 
Asad Abidi Group Members

Kashif Asad Ahmed
Farbod Behbahani (Ph.D. )
Anthony Brewster
Jing Cao
Patrick Chan
Glenn Chang
James Yung Chang
Jeffrey Chang
Paul Jinyung Chang
Michael Choi (Ph.D.)
William Colleran
Siavash Fallahi
Ramon Gomez
Koichi Hoshino
Karapet Khanoyan
Jikun Kim
Kwang-Young Kim
Haruo Kobayashi
Alexandre Rudolf Karl
Jaesup Lee
John Cumming Leete
Yoan-Tsang Liaw
Danny Daysang Loh
David John Loh
Patrick Pai
Hui Pan (Ph.D.)
Jacob Jude Rael
Ahmadreza Rofougaran (Ph.D.)
Maryam Rofougaran
Thomas Spargo
Wade Jay Stone
Shahrzad Tadjpour (Ph.D.)
Wee-Guan Tan
Chun Sei Tsai
Tyson Tuttle
Myles H. Wakayama
Yun-Ti Wang
Chun-Kai Wei
Joanne Joh-Mei Wu

Information as publishde by Prof. Asad Abidi group in 2005

Intel Facilities in Israel

2006 / مارس / الأثنين

Introduction

Intel has several facilities in Israel, including two chip factories. We had the chance to visit Fab18, located in Kiryat Gat, which manufactures Pentium 4 chips in 90 nm process and also chipsets and flash memories. In this coverage you will have a better notion of where Intel factories are located, what is the relationship between them and, of course, how Fab18 looks like inside and how a chip manufacturing facility works.

On Figure 1 you can see where Intel fabs and development centers are distributed in the world.

Intel Fabs

click to enlarge Figure 1: Location of Intel fabs and development centers in the world.

In the so-called fabs is where the wafers are processed, i.e. the wafer enters “virgin” and exit full of chips on it. Then the wafers are sent to other facilities, called “assembly and testing”, where they are cut and the devices (processors, chipsets, etc) are packed (terminals and a body are added).

As you can see on Figure 1, Intel has fabs only in three countries: United States, Ireland and Israel. Assembly and testing facilities are found near consumer markets.

So, the final product from Fab18 is wafer, to be sent to assembly and testing facilities. That’s why you never see “Israel” on the body of any CPU but “Costa Rica”, “Malaysia” or “Philippines”, for example.

Besides the two fabs (the other one, Fab8, is located in Jerusalem and is older, established in 1985 and the first fab outside the USA), Intel has several research and development centers in Israel, as you can see on Figure 2. As we already mentioned on our IDF Tel Aviv coverage, the Haifa team is responsible for creating Pentium M CPU and all other CPUs based on its architecture, like Yonah (dual-core Pentium M) and the forthcoming Merom, Conroe and Woodcrest.

The Petach Tikva team is in charge of the development of all cell CPUs from Intel and also Wi-Max technology, after Intel bought a company called Envara in 2004. This year Intel bought a company called Oplus, located in Yokneam, which develops HDTV decoder chips. The Yakum team is a branch of the Haifa team and also develops CPUs and chipsets for mobile platform.

Intel Fabs in Israel

click to enlarge Figure 2: Intel fabs and development centers in Israel.

Intel history in Israel is very old. The Haifa development facility was established in 1974 (just five years after Intel was established) with five engineers headed by Dov Frohman, the man that created the EPROM chip.

Now that you have an overall look about Intel’s activities in Israel, let’s go to Fab18.

Intel Fab18

Fab18 was established in 1999 and at that time produced Pentium III wafers. It was upgraded to the 90 nm process and now it produces wafers for Pentium 4 CPUs, chipsets and flash memories. There are 3,700 people working there.

Intel Fab18

click to enlarge Figure 3: Intel Fab18 in Kiryat Gat, Israel.

Before continuing, we’d suggest you to read our tutorial How Chips are Manufactured, for a better understanding of what we are going to talk from now on.

Due to its huge size – Fab18 has the size of two soccer courts – and to the very high cost of building and maintaining a clean room, instead of the entire factory being a huge clean room, only the parts needed to be operated under a clean environment use clean rooms. So the factory has several clean rooms. The area behind the clean rooms are called “chase”, and is where the process tools, electricity, exhaust, etc are located.

The floor of the clean rooms and the chases isn’t solid. It uses a mesh for allowing the air to circulate. The air is totally replaced every four minutes. Also, below the fab is where tanks with the chemical products necessary for the manufacturing process are located.

On Figure 4 you can see one of the clean rooms. Pay attention to the floor. Of course inside the clean rooms everybody must wear the so-called “bunny suits” to prevent contamination of the wafers (since the transistors created on the wafer are microscopic even the smallest particle of dust can destroy the chip being manufactured).

Intel Fab18 click to enlarge Figure 4: One of the clean rooms.

On this picture you can a technician handling a black box (called “lot”), which has wafers inside. He is putting the lot inside one machine, or processing tool. Only the “entrance” of the processing tool is located inside the clean room; its body is located in the chase, for cost reductions, as we mentioned.

Intel Fab18 (Cont’d)

On Figure 5 you can see a chase (pay attention on the floor). These are the machines that process the wafers and where the technician is putting the lot on Figure 4.

Intel Fab18

click to enlarge Figure 5: A chase.

The number of clean rooms and machines is impressive, because of the number of steps necessary to manufacture a CPU wafer. A Pentium 4 CPU uses 26 photolithographic masks. For each mask it may be necessary several steps to process it, plus the doping and metal layer stages. Thus the CPU manufacturing process can have hundreds of steps.

Just to give an example to clarify, for processing the first chip layer using the example we posted on our How Chips are Manufactured tutorial, the following steps would be necessary:

  • Grow silicon dioxide on the wafer.
  • Apply a layer of photoresist.
  • Apply the first mask.
  • Expose the wafer to ultraviolet light.
  • Remove the “soft” part of the photoresist layer using solvent.
  • Remove the exposed parts of silicon dioxide (etching process).
  • Remove the rest of the photoresist material.

As you can see, in this example for processing the first layer it would be necessary seven steps, each one occurring in a different place and using different machinery. On real chips more steps may be necessary. So imagine a CPU like Pentium 4 that has 26 masks.

On the steps where ultraviolet light is being applied, the clean room uses orange light, not white light like the other clean rooms, as you can see on Figure 6, because the photoresist layer is sensitive to white light.

Intel Fab18

click to enlarge Figure 6: Clean room running a photolithographic process (the light bulbs are orange).

Intel Fab18 (Cont’d)

As we mentioned, the technicians don’t handle the wafers directly. The wafers are located in squared boxes called lots, which holds 25 wafers each. On Intel fab, lots carrying wafers using aluminum on their metal layers are black, while wafers using copper on their metal layers are orange.

Intel Fab18

click to enlarge Figure 7: A lot (this is an older lot model and was located on the small Fab18 museum).

When the technician inserts the lot in the processing tool, the machine will open it, take each wafer, process it and then put the processed wafers back in the lot.

From one clean room to the other the lots are carried automatically by a set of tracks. On Figure 6 you can see a track (like a monorail train track) on the ceiling. That is where the lots are carried.

In some cases the track system brings the lot directly inside a machine, not needing an employee to put the lot inside it.

For each machine there is a screen where the technician can see what the machine is doing and which wafers are being processed.

As we mentioned, the final product from Fab18 is not ready-to-use CPUs, but wafers containing several chips. These wafers after being manufactured are sent to test and assembly factories located in other countries like Malaysia, Costa Rica and Philippines, where they cut the wafer, put terminals and a body on the chips, test them, label them and then ship to the market.

Politics of Hate

2005 / ديسمبر / الأحد
[White supremacist New Zealanders prepared to face up to the Sydney riots - Wikinews]

Read more at en.wikinews.org/wiki/Wh…